Substrates for electronics:
Silicon carbide (SSiC / SiSiC) substrate
Silicon carbide behaves almost like diamond (other spellings: silicon carbide and silicon carbide). Silicon carbide is the lightest, but also the hardest ceramic material with very good thermal conductivity, low thermal expansion and very good resistance to acids and alkalis.
Low density (3.07 to 3.15 g / cm3)
High hardness (580 HV10)
High modulus of elasticity (380 to 430 MPa)
High thermal conductivity (120 to 200 W / mK)
Low coefficient of linear expansion (3.6 to 4.1x10-6 / K at 20 to 400 ° C)
Maximum operating temperature of SSiC under protective gas: 1800 ° C
Very good thermal shock resistance of SiSiC: ΔT 1100 K
Corrosion-resistant and wear-resistant even at high temperatures
Good sliding properties
With silicon carbide ceramics, the material properties remain constant up to temperatures above 1400 ° C. The high modulus of elasticity of over 400 GPa ensures excellent dimensional stability.
These material properties predestine silicon carbide for use as a construction material. Corrosion, abrasion and flow wear are just as reliably controlled with silicon carbide as frictional wear. Components are used, for example, in chemical plants, mills, expanders and extruders or as nozzles.
The variants SSiC (sintered silicon carbide) and SiSiC (silicon-infiltrated silicon carbide) have become established. The latter is particularly suitable for the production of large, complex components.
Silicon carbide is toxicologically harmless, which enables it to be used in the food sector.
Another typical area of application for silicon carbide components is dynamic sealing technology with slide bearings and mechanical seals, such as in pumps and drive systems. In comparison to metals, silicon carbide enables very economical solutions with longer service lives, even when used in aggressive and high-temperature media.
Silicon carbide ceramics are also ideally suited for demanding application conditions in ballistics, chemical production, energy technology, paper production and as components for piping systems.
no stock items, delivery time & prices on request
more than 1000 pieces: on request
When using thermal paste or thermal adhesive, the following applies:
that the heat transfer is better, the thinner the order.
Ciliciumcarbid-substrates can be printed directly with us with PCM thermal paste.
More information on our PCM info page
Do you have questions or need more information? Our experts will be happy to assist you personally.
General questions & sales: Agnès Verbole
+49 (0) 202 - 40 43 51