Aluminium oxide (Al₂O₃) in its various degrees of purity is the most commonly used high-performance ceramic material.

The special property of aluminum titanate (Al₂TiO₅) is its very good thermal shock resistance. Components made of this material can withstand even abrupt temperature changes of several hundred degrees without damage, although they have low strengths.

Unlike other ceramic materials, zircon oxide (ZrO₂) has a very high resistance to crack propagation. In addition, zirconia ceramic has a very high thermal expansion and is therefore a popular choice for the realization of joints between ceramics and steel.

Aluminum nitride (AlN) is the only technical ceramics material to exhibit the extremely interesting combination of very high thermal conductivity and very good electrical insulation properties.

Silicium nitride (Si₃N₄) exhibit an excellent combination of material properties. They are almost as light as silicon carbide (SiC), but have very good thermal shock resistance due to their microstructure and are insensitive to shock and impact, thanks to their very high fracture toughness.

Almost like diamond, this is how silicon carbide (SSiC/SiSiC) (other spellings: silicon carbide and silicon carbide) behaves.

Silicon carbide is the lightest, but also the hardest ceramic material with very good thermal conductivity, low thermal expansion and very good resistance to acids and alkalis.

Attention:
High-tech ceramic substrates can be printed with PCM thermal paste directly from us. More information on our PCM info page.

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