Substrates for electronics:
Aluminum nitride (ALN) substrate
As the only technical ceramic material, aluminum nitride (ALN) has the extremely interesting combination of very high thermal conductivity and very good electrical insulation properties.
Very high thermal conductivity (> 170 W / mK)
High electrical insulation capacity (> 1x1012 Ω / cm)
Strength according to the double ring method> 320 MPa (biaxial strength)
Low thermal expansion 4 to 6x10-6K -1 (between 20 and 1000 ° C)
Aluminum nitride is therefore predestined for use in power and microelectronics and is used, for example, as a circuit carrier (substrate) for semiconductor construction or as a heat sink in LED lighting technology or high-performance electronics.
no stock items, delivery time & prices on request
more than 1000 pieces: on request
When using thermal paste or thermal adhesive, the following applies:
that the heat transfer is better, the thinner the order.
Ciliciumcarbid-substrates can be printed directly with us with PCM thermal paste.
More information on our PCM info page
Do you have questions or need more information? Our experts will be happy to assist you personally.
General questions & sales: Agnès Verbole
+49 (0) 202 - 40 43 51