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  • Heat Pipes

  • Heat Pipe-bending service

  • Peltier Modules

  • TEG

  • PCM-printing

  • Peltier-Controller

  • Thermo-Components

  • Development and consultation

5 100
Aluminumnitride-substrae
Aluminumnitride-substrae

Aluminumnitride-substrae

 
Question regarding the article

Substrates for electronics:
Aluminum nitride (ALN) substrate

 

As the only technical ceramic material, aluminum nitride (ALN) has the extremely interesting combination of very high thermal conductivity and very good electrical insulation properties.

 


Special features:

 

Very high thermal conductivity (> 170 W / mK)
High electrical insulation capacity (> 1x1012 Ω / cm)
Strength according to the double ring method> 320 MPa (biaxial strength)
Low thermal expansion 4 to 6x10-6K -1 (between 20 and 1000 ° C)
Good metallizability

 

Aluminum nitride is therefore predestined for use in power and microelectronics and is used, for example, as a circuit carrier (substrate) for semiconductor construction or as a heat sink in LED lighting technology or high-performance electronics.

 

RoHS Compliant

no stock items, delivery time & prices on request

 

 

more than 1000 pieces: on request

 

Important:

 

When using thermal paste or thermal adhesive, the following applies:
that the heat transfer is better, the thinner the order.

 

Attention:


Ciliciumcarbid-substrates can be printed directly with us with PCM thermal paste.

 

More information on our PCM info page

 

Do you have questions or need more information? Our experts will be happy to assist you personally.

 

General questions & sales: Agnès Verbole
+49 (0) 202 - 40 43 51

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