QC-PCM is an innovative TIM (Thermal Interface Material) with phase change properties. It is particularly suitable for the thermal connection of electronic components to heat sinks or other cooling surfaces in series production as a replacement for a manually applied thermal paste. Above the phase change temperature, the printed and completely dried thermal paste is distributed even under low pressure and completely wets the surface. An extremely thin layer is achieved, which together with the excellent thermal conductivity leads to a low thermal resistance. Surface roughness and slight unevenness are evened out, air inclusions are expelled. At no point does the TIM leak or pump out. The parts printed with the QC-PCM can be processed very easily in automated processes or by pick-and-place robots.
Thermal connection of:
- Heat conducting disks, heat sinks - IGBTs or MOSFETs - Processors - Components in electronics / microelectronics in series production
- Very good replacement for conventional WLP - Extremely thin layer due to defined imprint - Thermal conductivity 3.4W / mK - Silicone free - Print pattern freely selectable - Maximum reproducibility, no manual application - Clean workplaces, dry print
Mounting material / TIM:
Due to the diverse area of application, it is necessary to design the thermal management precisely for the requirements of the project. The correct and safe assembly of the individual components plays a key role here. The use of assembly aids ensures optimum hold and effective heat transfer. In addition, thermal interface material (TIM) is an important factor in the implementation of the planning. This is mostly a ceramic-based paste, which is mixed with microscopic particles of aluminum oxide, boron nitride and zinc oxide. Silicone-Free and several special synthetic oils helps to achieve long-term stability and guarantees extraordinary performance.
During application, the viscosity of the TIM is reduced. As a result, the smallest surface roughness is smoothened, and air inclusions are displaced. The paste solidifies in the first 20-30 hours of operation and prevents expansion caused by temperature fluctuations. With a temperature range from -40 °C to 180 °C, thermal paste is suitable for various areas of application. It also isolates electrical current and is electrically non-capacitive.
Thermal paste is used wherever an efficient heat transfer between two objects is to be achieved. For example between a microchip and a heat sink.
The printing process is recommended for applications where conventional thermal paste cannot be used or where mass production of components is necessary. This enables a phase change material (PCM) to be applied directly to individual elements. At room temperature this material is dry and malleable. The PCM has the property that the phase transition takes place only when it is mounted at a pressure of 30N / cm² and around 45°C. In this way, it fills cavities and gaps optimally and thus guarantees the best heat transfer. The use of conventional thermal paste (WLP) is no longer necessary.
Material: printed phase change material Color gray Density: 2.0g / cm3 RoHS conformity: Yes, 2011/65 / EU Thermal conductivity: 3.4 W / mK Thermal resistance at 1MPa: 0.002 ° C cm2 / W Thermal resistance at 200kPa: 0.0039 ° C cm2 / W Thermal resistance at 70kPa: 0.2 ° C cm2 / W Phase change temperature: 45 ° C Shelf life when printed: Unlimited in a dust-free environment Maximum application temperature: 125 ° C
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